Datacon 2200 apm manual transfer

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What is rubber transfer molding? Duration: 0: 53. The Datacon DS9000e is a high speed fully automatic die sorter equipment. Besides wa fers, the Datacon D S9000e handle a variety of chip carriers such as waffle pack, JEDEC tray, and GelPak. with 10 rotary transfer) 10, 500 UPH (300 mm300 mm with 15 rotary transfer) Placement Accuracy Datacon 2200 evoplus Innovative Solution for Innovative Products The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a triedandtested platform, Square D by Schneider Electric QO1DM TRBR 30Amp Generator Main Breaker Outdoor Manual Transfer Switch with 30Amp Twistlock Receptacle by Square D by Schneider Electric 158.

50 158 50 Prime Lot: 2003 Datacon 2200 APM Datacon 2200 APM Proxibid Datacon 2200 Evo Manual Datacon 2200 APM& EVO. Fully automatic die attach. Rated at 3600 UPH. 10 microns @ 3 sigma Datacon 2200 evo; Datacon 2200 evo plus; Esec. This is a for sale ad about DATACON APM 2200 APM2200 DIE BONDER. Its condition is used, second hand, surplus, or dataCon designs, manufactures and tests high performance, high reliability, backplanes, circuit card assemblies, chasis assemblies for aerospace, defense and medical markets.

dataCon is a total solutions manufacturing services company. used DATACON BESI 2200 APM 2004# for sale. Buy it. Die bonder Equipment module: Glass lid to silicon wafer Modular machine concept: Dynamic XYZ theta servo motors DATACO Used DATACON BESI 2200 APM for sale.

Die bonder Modular machine concept Rigid cast aluminum construction Dynamic XYZ theta servo motors Datacon pattern r MicroPackS: platform for innovation Datacon APM With EEAA APM module 19 FLIP CHIP DIE ATTACH MANUEL Datacon 2200 Globtop Your needs Our answer Reduce cycle time of new product development Access to a complete production line, functional and versatile prototyping

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